University of Illinois

Hohyun Keum

Seok Kim

Jun Kyu Park

Moonsub Shim

Yiran Jiang

Zining Yang

A method of making a bonded polymeric assembly by transfer printing comprises contacting a stamp with a solid-phase ink comprising a photoresist to form an inked stamp, where the solid-phase ink is reversibly bound to the stamp. The inked stamp is aligned with an object comprising the photoresist and is stamped onto the object. The stamp is then removed, thereby transferring the solid-phase ink onto the object. The solid-phase ink is thermally joined with the object. Thus, a bonded polymeric assembly comprising a bonded joint between the solid-phase ink and the object is formed.

Methods of making a bonded assembly and a re-entrant structure, and method of transfer printing a masking layer

The present disclosure describes one or more embodiment of a method for creating a patterned quantum dot layer. The method includes bringing a patterning stamp in contact with a layer of quantum dots disposed on a substrate, the patterning stamp comprising a patterned photoresist layer disposed on an elastomer layer, such that a portion of the quantum dots in contact with the patterned photoresist layer adheres to the patterning stamp, the portion of the quantum dots being adhered quantum dots. The method also includes peeling the patterning stamp from the substrate with a peeling speed larger than a pre-determined peeling speed to remove the adhered quantum dots from the substrate. A remaining portion of the quantum dots forms a patterned quantum dot layer on the substrate.

Photoresist contact patterning of quantum dot films

A method for microassembly of heterogeneous materials comprises contacting a stamp with an ink disposed on a donor substrate to form an inked stamp, where the ink is reversibly bound to the stamp. The inked stamp is stamped onto a receiving substrate or onto an object on the receiving substrate, and the stamp is removed, thereby transferring the ink to the receiving substrate. The ink and the receiving substrate or the ink and the object are thermally joined, thereby forming a microassembly of heterogeneous materials. The ink may comprise a first material and the receiving substrate or the object may comprise a second material different from the first material.

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Champaign, IL, United States of America

Hohyun Keum