Yongin-si, South Korea

Ho Suk Maeng

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Display Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ho Suk Maeng. Retrieved from https://idiyas.com/inventor/ho-suk-maeng-55560go6

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ho Suk Maeng: Semiconductor Packaging Innovation

Introduction

Ho Suk Maeng is an inventor based in Yongin-si, South Korea, associated with Samsung Display Co., Ltd. His patent work addresses the design and manufacture of semiconductor packaging materials.

Latest Patents

Maeng is named on 1 patent: “Semiconductor Package Film and Manufacturing Method Thereof.” The invention describes a package film with a base film, sprocket holes, and a circuit line. A support member positioned near the sprocket holes includes an elongated support and protective walls arranged around the holes. The design focuses on supporting and protecting the film’s edge area during handling and manufacturing.

Career Highlights

Maeng’s listed patent reflects work in semiconductor packaging and film construction. His association with Samsung Display connects his inventive activity to a company working in display and related technologies.

Collaborations

Maeng’s listed coworkers include Ji Ye Lee and Soo Yeon Kim. They are associated with his professional context, though the provided information does not specify their roles in the patent.

Conclusion

Ho Suk Maeng’s patent documents an approach to supporting and protecting sprocket-hole areas in semiconductor package film, highlighting his contribution to packaging-related innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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