The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2026

Filed:

Jan. 30, 2024
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Ji Ye Lee, Yongin-si, KR;

Ho Suk Maeng, Yongin-si, KR;

Soo Yeon Kim, Yongin-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H10W 70/04 (2026.01); H10W 70/40 (2026.01);
U.S. Cl.
CPC ...
H10W 70/453 (2026.01); H05K 1/0271 (2013.01); H05K 1/0284 (2013.01); H05K 1/115 (2013.01); H10W 70/047 (2026.01);
Abstract

A semiconductor package film includes a base film having sprocket holes arranged in a first direction in an edge area at a periphery of a main area. The edge area is adjacent to the main area in a second direction intersecting the first direction. The semiconductor package film includes a circuit line disposed in the main area, and a support member disposed on the base film, the support member being adjacent to the sprocket holes in the edge area. The support member includes a support extending in the first direction, and protective walls connected to the support. The protective walls are spaced apart from each other with the sprocket holes disposed between the protective walls.


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