Ho-Ku Lan

Title: Ho-Ku Lan: Innovator in Semiconductor Technology

Introduction

Ho-Ku Lan is a prominent inventor based in Zhubei, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor structure that enhances manufacturing methods.

Latest Patents

Ho-Ku Lan holds a patent for a semiconductor structure and its manufacturing method. This patent describes a semiconductor structure that includes a substrate, a dam element, a first isolation layer, a second isolation layer, and a conductive layer. The substrate features a conductive pad, a trench, a sidewall, a first surface, and a second surface opposite to the first surface. The conductive pad is located on the second surface, while the trench has a first opening at the first surface and a second opening at the second surface. The dam element is positioned on the second surface, covering the second opening and featuring a concave portion at that opening. The first isolation layer is placed on a portion of the sidewall, and the second isolation layer is located on the first surface and the sidewall not covered by the first isolation layer, forming an interface between the two layers. This innovative design is crucial for advancing semiconductor technology.

Career Highlights

Ho-Ku Lan is currently employed at Xintec Corporation, where he continues to push the boundaries of semiconductor innovation. His work at Xintec has positioned him as a key player in the industry, contributing to the company's reputation for excellence in semiconductor manufacturing.

Collaborations

Ho-Ku Lan has collaborated with notable colleagues, including Yu-Lin Yen and Hung-Chang Chen. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Ho-Ku Lan's contributions to semiconductor technology through his patent and work at Xintec Corporation highlight his role as an influential inventor in the field. His innovative designs and collaborations continue to shape the future of semiconductor manufacturing.