This inventor holds 1 USPTO granted patent. Top assignee: Kabushiki Kaisha Shinkawa. Active years: 2005.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2005
Title: Hitoshi Watanabe: Innovator in Bonding Technology
Introduction
Hitoshi Watanabe is a notable inventor based in Musashimurayama, Japan. He has made significant contributions to the field of bonding technology, particularly with his innovative approach to setting operating parameters for bonding tools.
Latest Patents
Watanabe holds a patent for a "Bonding data setting device and method." This invention facilitates and enhances the efficiency of setting the operating parameters of a bonding tool used to form wire loops into desired shapes. When an editing handle is dragged, the loop shape of a wire loop line drawing displayed on a screen is redrawn as a secondary loop line drawing. The values of the operating parameters corresponding to the loop shape of the drawn or redrawn secondary loop line drawing are calculated, and the results are displayed in a parameter list. He has 1 patent to his name.
Career Highlights
Hitoshi Watanabe is associated with Kabushiki Kaisha Shinkawa, where he applies his expertise in bonding technology. His work has contributed to advancements in the efficiency and effectiveness of bonding processes.
Collaborations
Watanabe collaborates with Kazumasa Kimura, a fellow innovator in the field. Their partnership has fostered a creative environment that encourages the development of new technologies.
Conclusion
Hitoshi Watanabe is a prominent figure in the realm of bonding technology, with a focus on improving the efficiency of bonding tools. His innovative patent and collaboration with other professionals highlight his commitment to advancing this field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile