Yokohama, Japan

Hitoshi Mukohjima


Average Co-Inventor Count = 2.5

ph-index = 12

Forward Citations = 358(Granted Patents)


Location History:

  • Yokohama, JP (1987 - 1999)
  • Fukuoka, JP (1993 - 2021)

Company Filing History:


Years Active: 1987-2021

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21 patents (USPTO):

Title: Innovations of Hitoshi Mukohjima in Bonding Technologies

Introduction: Hitoshi Mukohjima, a prominent inventor based in Yokohama, Japan, has made significant contributions to the field of bonding technologies, holding a remarkable total of 21 patents. His innovative designs and inventions reflect his extensive experience and dedication to advancing technology in this arena.

Latest Patents: Among his latest patents, the "Bonding Apparatus" stands out. This apparatus features a movable light guide, a first capture, a second capture, a detector, an aligner, and a mover. The system is expertly designed so that when the movable light guide is positioned between a chip and a board, images of the chip and bonding position are processed efficiently. The apparatus allows for precise detection of positional deviations and the relative movement of bonding tools, enhancing the accuracy of bonding processes. Another significant patent is the "Component Pressing Device," which features a component pressing head capable of holding components effectively while rotating and pressing in an axial direction. This inventive design incorporates two voice coil motors that work in unison to enhance the device's functionality.

Career Highlights: Hitoshi Mukohjima has had an impressive career, working with leading companies in technology and intellectual property. He has contributed to the innovative legacies of Canon Inc. and Panasonic Intellectual Property Management Co., Ltd. His work at these firms underscores his expertise in developing advanced bonding technologies, leading to numerous patents that serve various industrial applications.

Collaborations: Throughout his career, Mukohjima has collaborated with notable professionals in the field, including Akira Hiramatsu and Ichiro Okumura. These partnerships have not only fostered innovation but have also paved the way for notable advancements in bonding technology, reflecting the collaborative spirit of the industry.

Conclusion: Hitoshi Mukohjima's inventive contributions, embodied in his 21 patents, have significantly influenced bonding technology. His latest innovations demonstrate a commitment to enhancing precision and efficiency within the industry. As he continues to innovate, Mukohjima remains a pivotal figure whose work will inspire future advancements in technology.

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