The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 2021

Filed:

May. 08, 2019
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventor:

Hitoshi Mukohjima, Fukuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G06T 7/73 (2017.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); G06T 7/001 (2013.01); G06T 7/74 (2017.01); G06T 2207/30148 (2013.01); H01L 2224/75343 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75841 (2013.01);
Abstract

A bonding apparatus includes a movable light guide, a first capture, a second capture, a detector, an aligner, and a mover. When the movable light guide is positioned between a chip and a board, an image of the chip is made incident from a first incident port and emitted from a first emission port, and an image of a bonding position of the board is made incident from a second incident port and emitted from a second emission port. The first capture images the image of the chip emitted from the first emission port. The second capture images the bonding position emitted from the second emission port. The detector detects a relative positional deviation of the chip and the bonding position. The aligner relatively moves a bonding tool and a stage. The mover advances and retreats the movable light guide.


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