Ube, Japan

Hitoshi Kodama

This inventor holds 1 USPTO granted patent. Top assignee: Ube Corporation. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hitoshi Kodama. Retrieved from https://idiyas.com/inventor/hitoshi-kodama-vk12i5gk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Hitoshi Kodama: Inventor of a Polyamide Resin Composition

Introduction

Hitoshi Kodama is an inventor associated with Ube, Japan, and Ube Corporation. His patent work includes a polyamide resin composition designed to combine useful mechanical characteristics, bonding properties, and resistance to calcium chloride.

Latest Patents

Kodama is credited with 1 patent: “Polyamide Resin Composition.” The invention describes a composition containing 70 to 99 mass percent aliphatic polyamide resin with a specified amino group concentration, along with defined amounts of polyalkylene glycol alkyl ether and polyolefin wax. It may also include aromatic polyamide resin and other components, with the ingredients totaling 100 mass percent. The composition is intended to bond suitably with acid-modified polyolefin, which has a specified range of acid modification.

Career Highlights

Kodama’s listed patent reflects work on polymer materials and their bonding performance. The invention focuses on balancing mechanical properties, adhesion, and calcium chloride resistance in a polyamide resin composition.

Collaborations

The provided information lists Tetsuya Yasui and Akane Sakamoto as Kodama’s coworkers. It does not specify their roles in the patent or the extent of their collaboration.

Conclusion

Hitoshi Kodama’s recorded invention at Ube Corporation concerns a carefully formulated polyamide resin composition intended to deliver practical mechanical, bonding, and chemical-resistance properties.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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