The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2025

Filed:

Mar. 19, 2021
Applicant:

Ube Corporation, Ube, JP;

Inventors:

Tetsuya Yasui, Ube, JP;

Akane Sakamoto, Ube, JP;

Yuki Suedomi, Ube, JP;

Hitoshi Kodama, Ube, JP;

Kosuke Oishi, Ube, JP;

Takashi Kumagai, Ube, JP;

Mikako Fujita, Ube, JP;

Assignee:

UBE CORPORATION, Ube, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/10 (2006.01); B29C 45/00 (2006.01); B29C 45/16 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); C08L 77/02 (2006.01); B29K 71/00 (2006.01); B29K 77/00 (2006.01); B29K 223/00 (2006.01);
U.S. Cl.
CPC ...
C08L 77/02 (2013.01); B29C 45/0001 (2013.01); B32B 7/10 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B29C 45/16 (2013.01); B29K 2071/02 (2013.01); B29K 2077/00 (2013.01); B29K 2223/06 (2013.01); B29K 2995/0021 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2270/00 (2013.01); B32B 2307/54 (2013.01); B32B 2307/546 (2013.01); B32B 2307/714 (2013.01); B32B 2605/08 (2013.01); C08L 2203/30 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01);
Abstract

The present invention relates to a polyamide resin composition that is excellent in mechanical characteristics, bonding properties and calcium chloride resistance and is suitably bonded to an acid-modified polyolefin, wherein the polyamide resin composition includes 70 to 99 mass % of an aliphatic polyamide resin (A) having an amino group concentration of 46 to 110 μmol/g, 0 to 18 mass % of an aromatic polyamide resin (B), 0.01 to 0.50 mass % of a polyalkylene glycol alkyl ether (C), 0.01 to 0.50 mass % of a polyolefin wax (D) and 0 to 22.98 mass % of a component (E) other than (A) to (D), and the total of (A) to (E) is 100 mass %, and wherein the acid-modified polyolefin having an amount of acid modification of 8 to 100 μmol/g.


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