Hiratsuka, Japan

Hitoshi Kigawa


Average Co-Inventor Count = 2.8

ph-index = 2

Forward Citations = 11(Granted Patents)


Location History:

  • Hiratsuka, JP (1994)
  • Tokyo, JP (1998)

Company Filing History:


Years Active: 1994-1998

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3 patents (USPTO):Explore Patents

Title: Hitoshi Kigawa: Innovator in Epoxy Resin Curing Technology

Introduction

Hitoshi Kigawa is a notable inventor based in Hiratsuka, Japan. He has made significant contributions to the field of epoxy resin technology, holding a total of 3 patents. His work focuses on improving the curing methods of epoxy resins, which are widely used in various applications.

Latest Patents

One of Hitoshi Kigawa's latest patents is centered around a monomer mixture and a method for its preparation. This innovative method enhances the curing process of epoxy resins by incorporating a polyamide derived from a specific condensation reaction. The resulting epoxy resin composition exhibits a remarkably low viscosity, making it easier to handle compared to traditional polyamide curing agents. This advancement is particularly beneficial when flexibility or bendability is required in the cured epoxy resin.

Career Highlights

Hitoshi Kigawa is currently employed at Lion Corporation, where he continues to develop and refine his innovative ideas. His expertise in epoxy resin technology has positioned him as a key figure in the industry, contributing to advancements that improve product performance and usability.

Collaborations

Hitoshi has collaborated with talented coworkers such as Hiroshi Yamaya and Yurie Iino. Their combined efforts have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Hitoshi Kigawa's contributions to epoxy resin curing technology exemplify the impact of innovative thinking in the field of materials science. His patents reflect a commitment to enhancing product performance and usability, making him a significant figure in the industry.

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