The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 1994
Filed:
Jul. 30, 1992
Hitoshi Kigawa, Hiratsuka, JP;
Akira Ohishida, Tokyo, JP;
Lion Corporation, Tokyo, JP;
Abstract
An improvement is proposed in the curing method of an epoxy resin by the admixture of a polyamide as a crosslinking curing agent, in which the curing agent as well as the epoxy resin composition with admixture of the curing agent has an outstandingly low viscosity as compared with the use of a conventional polyamide to facilitate handling. The improvement can be obtained by using, as the polyamide, a condensation reaction product between (A) an alkylene polyamine having 4 to 20 carbon atoms in a molecule and (B) a dimeric acid mixture containing at least 50% by weight of a non-cyclic dimeric acid or an alkyl ester thereof represented by the general formula ##STR1## in which each R is, independently from the other, a hydrogen atom or a C.sub.1-4 alkyl group obtained by the dimerization reaction of oleic acid or an alkyl ester thereof. When flexibility or bendability is desired of the cured epoxy resin, the condensation reaction is performed, in addition to the reactants (A) and (B), with admixture of a C.sub.5-21 monobasic carboxylic acid or an alkyl ester thereof.