Hisatoshi Atsumo

Title: Hisatoshi Atsumo: Innovator in Heat Conductive Substrates

Introduction

Hisatoshi Atsumo is a notable inventor based in Mino, Japan. He has made significant contributions to the field of manufacturing, particularly in the development of heat conductive substrates. His innovative approach addresses common challenges faced in the industry.

Latest Patents

Hisatoshi holds a patent for a "Method of manufacturing heat conductive substrate." This invention provides a solution to substrate contamination on the surface of lead frames caused by the oozing or push out of thermosetting resin composite during heat-pressurization. The method effectively prevents the oozing or push out of thermosetting resin composite from the through hole of the lead frame by utilizing a film attached to the components mounting surface of the lead frame. His patent portfolio includes 1 patent.

Career Highlights

Hisatoshi is currently employed at Matsushita Electric Industrial Co., Ltd., a company known for its commitment to innovation and quality in electronic products. His work at this esteemed organization has allowed him to further develop his expertise in manufacturing processes.

Collaborations

Throughout his career, Hisatoshi has collaborated with talented individuals such as Tetsuya Tsumura and Shinya Tanaka. These partnerships have contributed to the advancement of technology in their respective fields.

Conclusion

Hisatoshi Atsumo's contributions to the manufacturing of heat conductive substrates highlight his innovative spirit and dedication to solving industry challenges. His work continues to influence the field and pave the way for future advancements.