The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2007
Filed:
Mar. 04, 2004
Tetsuya Tsumura, Ikoma, JP;
Shinya Tanaka, Ichishi-gun, JP;
Michihiro Miyauchi, Suita, JP;
Hisatoshi Atsumo, Mino, JP;
Yoshiyuki Miyoshi, Tsu, JP;
Tetsuya Tsumura, Ikoma, JP;
Shinya Tanaka, Ichishi-gun, JP;
Michihiro Miyauchi, Suita, JP;
Hisatoshi Atsumo, Mino, JP;
Yoshiyuki Miyoshi, Tsu, JP;
Matsushita Electric Industrial Co., Ltd., Kadoma-Shi, JP;
Abstract
The present invention offers a method of manufacturing a heat conductive substrate, with which substrate contamination on the surface of lead frame due to oozing or push out of thermosetting resin composite during heat-pressurization is suppressed. The oozing or push out of thermosetting resin composite from the through hole of lead frame can be prevented by a film attached on the components mounting surface of lead frame.