Hisashi Morikawa

This inventor holds 12 USPTO granted patents and 1 EPO patent. Top assignees: Matsushita Electric Industrial Co., Ltd., Panasonic Intellectual Property Management Co., Ltd., Panasonic Corporation. Active years: 1995-2019.

USPTO Granted Patents = 12

% Patents Active = 75.0

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 5.2

ph-index = 4

Forward Citations = 37(Granted Patents)

Location History:

Kitakatsuragi, JP (1995)
Nara, JP (2002 - 2012)
Kitakatsuragi-gun, JP (2003 - 2016)
Shiga, JP (2016 - 2019)

Company Filing History:

7 out of 27,375

Matsushita Electric Industrial Co., Ltd.

patents

3 out of 13,338

Panasonic Intellectual Property Management Co., Ltd.

patents

2 out of 16,454

Panasonic Corporation

patents

Years Active: 1995-2019

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12 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10512154 - Grounding structure for circuit board (2019-12-17),

2. 9370091 - Grounding structure for circuit board (2016-06-14),

3. 9357591 - High-frequency heating apparatus (2016-05-31),

4. 8217323 - High-frequency heating device (2012-07-10),

5. 8017893 - High-frequency heating apparatus (2011-09-13),

6. 7414228 - High frequency heating apparatus (2008-08-19),

7. 7282682 - High-frequency heating apparatus (2007-10-16),

8. 6970065 - Transformer and transformer unit having the same (2005-11-29),

9. 6740968 - Power source unit for driving magnetron and heatsink to be mounted on printed circuit board thereof (2004-05-25),

10. 6624579 - Magnetron drive power supply (2003-09-23),

11. 6445596 - Magnetron drive power supply (2002-09-03),

12. 5393961 - Air cooling fan arrangement in a microwave heating device (1995-02-28),

Title: Hisashi Morikawa: Innovator in Circuit Board Technology

Introduction

Hisashi Morikawa is a prominent inventor based in Nara, Japan. He has made significant contributions to the field of circuit board technology, holding a total of 12 patents. His innovative designs have improved the functionality and efficiency of electronic devices.

Latest Patents

Morikawa's latest patents include a groundbreaking grounding structure for circuit boards. This design features a protruding portion that prevents rotation during screw fastening of a connection member. The configuration ensures that the protruding portion does not interfere with an earth member or bracket located on the back side of the printed circuit board. This allows for greater flexibility in the design of the earth member and bracket. Another similar patent also focuses on the same grounding structure, emphasizing the importance of preventing interference with components on the back side of the circuit board.

Career Highlights

Throughout his career, Morikawa has worked with notable companies such as Matsushita Electric Industrial Co., Ltd. and Panasonic Intellectual Property Management Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Some of Morikawa's coworkers include Haruo Suenaga and Hideaki Moriya. Their collaboration has likely fostered an environment of creativity and innovation, leading to the development of advanced technologies in the field.

Conclusion

Hisashi Morikawa's contributions to circuit board technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the design and functionality of electronic devices today.