The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2008

Filed:

Apr. 09, 2004
Applicants:

Haruo Suenaga, Katano, JP;

Hideaki Moriya, Yamatokoriyama, JP;

Hisashi Morikawa, Kitakatsuragi-gun, JP;

Shinichi Sakai, Nara, JP;

Makoto Mihara, Nara, JP;

Nobuo Shirokawa, Nara, JP;

Toyotsubu Matsukura, Nara, JP;

Masato Matsuda, Shiki-gun, JP;

Inventors:

Haruo Suenaga, Katano, JP;

Hideaki Moriya, Yamatokoriyama, JP;

Hisashi Morikawa, Kitakatsuragi-gun, JP;

Shinichi Sakai, Nara, JP;

Makoto Mihara, Nara, JP;

Nobuo Shirokawa, Nara, JP;

Toyotsubu Matsukura, Nara, JP;

Masato Matsuda, Shiki-gun, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 6/68 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is constructed a constitution such that a shunt resistoris interposed in series with a portion capable of measuring an output current of a unidirectional power source portionof a high frequency heating apparatus and a voltage generated at the shunt resistoris outputted by a buffer. Further, an operational amplifierhaving a high input impedance is used for the buffer. Further, a diode bridgeand a semiconductor switching elementare fixed to a common heat radiating plate, the heat radiating plateis formed with a notched portionto thereby ensure insulating distances to the diode bridgeand the semiconductor switching element, and the shunt resistoris arranged on a straight line the same as that between the diode bridgeand the semiconductor switching element


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