Osaka, Japan

Hisakazu Horii

This inventor holds 1 USPTO granted patent. Top assignee: Konishi Co., Ltd.. Active years: 2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hisakazu Horii. Retrieved from https://idiyas.com/inventor/hisakazu-horii

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: Hisakazu Horii: Innovator in Epoxy Resin Technology

Introduction

Hisakazu Horii is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of epoxy resin technology. His innovative work focuses on creating compositions that enhance the performance and stability of epoxy resins.

Latest Patents

Hisakazu Horii holds a patent for a one-pack moisture-curing epoxy resin composition. This composition can be cured at ordinary temperatures and is designed to improve storage stability without compromising the quickness of curing. The formulation includes one or more members selected from vinyl carboxylates and epoxy-containing silyl compounds, along with ketimines, oxazolidines, and an epoxy resin. This innovative approach addresses the challenge of balancing two properties that are typically incompatible.

Career Highlights

Horii is currently employed at Konishi Co., Ltd., where he continues to develop advanced materials. His work has been instrumental in enhancing the performance of epoxy resins, making them more versatile for various applications. His expertise in this area has positioned him as a key figure in the industry.

Collaborations

Hisakazu Horii has collaborated with notable colleagues, including Takeshi Endo and Fumio Sanda. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Hisakazu Horii's contributions to epoxy resin technology exemplify the spirit of innovation. His work not only advances the field but also sets a benchmark for future developments in material science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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