The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2006
Filed:
Dec. 17, 2001
Takeshi Endo, Yamagata, JP;
Fumio Sanda, Kyoto, JP;
Hisakazu Horii, Osaka, JP;
Kentaro Suzuki, Osaka, JP;
Nobuki Matsuura, Osaka, JP;
Takeshi Endo, Yamagata, JP;
Fumio Sanda, Kyoto, JP;
Hisakazu Horii, Osaka, JP;
Kentaro Suzuki, Osaka, JP;
Nobuki Matsuura, Osaka, JP;
Konishi Co., Ltd., Osaka, JP;
Abstract
A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition includes one ore more members selected from the group consisting of vinyl carboxylates of the general formula (1) and epoxy-containing silyl compounds of the general formula (2), one or more members selected from the group consisting of ketimines and oxazolidines, and an epoxy resin. (1) [In the general formula (1), R, R, R, and Rare each independently hydrogen or an organic group; and n is an integer of 1 or above] (2) [In the general formula (2), Rand Rare each independently alkyl; Ris an epoxy-containing organic group; and n is an integer of 1 to 3]