Company Filing History:
Years Active: 2004
Title: Hiroyuki Watanabe: Innovator in Substrate Bonding Technology
Introduction
Hiroyuki Watanabe is a notable inventor based in Odawara, Japan. He has made significant contributions to the field of substrate bonding technology. His innovative approach has led to the development of a unique method and apparatus for bonding substrate plates together.
Latest Patents
Watanabe holds a patent for a "Method and apparatus for bonding substrate plates together through gap-forming sealer material." This invention involves a process for registering and bonding upper and lower substrate plates using a sealer material. The method ensures that a predetermined gap is formed between the two plates. The registered substrate plates are initially pressed to create a joined assembly, which is then subjected to heat at a hot press station. This process compresses the sealer material and thermally hardens it, establishing the desired gap. To address positional deviations during hot pressing, the upper and lower substrates are set in offset positions, allowing for precise alignment.
Career Highlights
Hiroyuki Watanabe is associated with Hitachi Electronics Engineering Co., Ltd., where he has been instrumental in advancing substrate bonding technologies. His work has been recognized for its innovative approach and practical applications in the industry.
Collaborations
Watanabe has collaborated with notable colleagues, including Yuji Otsubo and Shinji Sugizaki. Their combined expertise has contributed to the success of various projects within the company.
Conclusion
Hiroyuki Watanabe's contributions to substrate bonding technology exemplify the impact of innovation in engineering. His patented methods continue to influence the industry and enhance manufacturing processes.