The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2004
Filed:
Sep. 14, 2001
Hiroyuki Watanabe, Odawara, JP;
Yuji Otsubo, Isehara, JP;
Shinji Sugizaki, Odawara, JP;
Hisayoshi Ichikawa, Ashigara, JP;
Hiroaki Kiyomiya, Yokohama, JP;
Hitachi Electronics Engineering Co., Ltd., Tokyo, JP;
Abstract
Method and apparatus for registering and bonding upper and lower substrate plates together through a sealer material and in such a way as to form a gap of a predetermined width between the two substrate plates. Registered substrate plates are provisionally pressed to form a joined substrate assembly, which is then pressed under heated conditions at a hot press station, thereby compressing the sealer material into a flattened form and at the same time thermally hardening the sealer material to form a predetermined gap space between the two substrate plates. In order to correct positional deviations which occur to the upper and lower substrate plates in the course of the hot pressing, on the basis detected positional deviations of upper and lower substrate plates of a hot-pressed substrate assembly, upper and lower substrates are set in offset positions instead of aligned positions when registering them at the provisional press station to cancel predicted positional deviations at the hot press station.