Hiroyuki Matuno

Title: Hiroyuki Matuno: Innovator in Semiconductor Assembly Technology

Introduction

Hiroyuki Matuno is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor assembly technology. His innovative work has led to the development of a unique supply device that enhances the efficiency of semiconductor assembly processes.

Latest Patents

Hiroyuki Matuno holds 1 patent for his invention titled "Supply device used in a semiconductor assembly apparatus." This device is designed for use in semiconductor assembly machines, such as wire bonding and pellet bonding devices. The invention features an elevator section with a table that raises and lowers to carry a magazine containing plate-form workpieces. It includes a magazine stacker that guides the magazine and a pusher assembly that pushes the workpiece out of the magazine one at a time. The magazine stacker consists of a fixed guide and a movable guide, which is adjustable in size to facilitate the workpiece's ejection. The pusher device is powered by a source installed parallel to the stacked workpieces in the magazine.

Career Highlights

Hiroyuki Matuno is associated with Kabushiki Kaisha Shinkawa, where he has been instrumental in advancing semiconductor assembly technologies. His work has not only improved the efficiency of existing processes but has also paved the way for future innovations in the field.

Collaborations

Hiroyuki has collaborated with notable colleagues, including Hiroshi Ushiki and Takashi Endo. Their combined expertise has contributed to the successful development of advanced technologies in semiconductor assembly.

Conclusion

Hiroyuki Matuno's contributions to semiconductor assembly technology exemplify the spirit of innovation. His patent for a supply device showcases his commitment to enhancing efficiency in the industry. His work continues to influence the field and inspire future advancements.