Hiratsuka, Japan

Hiroyuki Kusamori

This inventor holds 3 USPTO granted patents. Top assignee: Tanaka Kikinzoku Kogyo K.k.. Active years: 2002-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroyuki Kusamori. Retrieved from https://idiyas.com/inventor/hiroyuki-kusamori

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Kanagawa, JP (2002)
  • Hiratsuka, JP (2009 - 2024)

Company Filing History:


Years Active: 2002-2024

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3 patents (USPTO):Explore Patents

Title: Hiroyuki Kusamori: Innovator in Sealing Technologies

Introduction

Hiroyuki Kusamori is a notable inventor based in Hiratsuka, Japan. He has made significant contributions to the field of sealing technologies, holding a total of 3 patents. His work focuses on creating innovative solutions that enhance the functionality and reliability of packaging.

Latest Patents

One of Kusamori's latest patents is a sealing lid formed from translucent material. This invention relates to a sealing lid for a package containing an optical element. The sealing lid utilizes a translucent material, such as glass, that can transmit visible light. The design includes a lid main body made of this translucent material, featuring a joining region with a frame shape that corresponds to the outer circumferential shape of the lid. A plurality of pieces of brazing material made of a eutectic alloy are fused on the joining region, arranged in a continuous frame shape.

Another significant patent is a seal cover structure comprising a nickel-tin (Ni–Sn) alloy barrier layer. This hermetic seal cover is designed to inhibit defects, such as voids, from generating during the sealing of a package. The seal cover consists of a main body, a Ni plating layer applied to its surface, and an Au–Sn brazing material layer fusion bonded to the Ni plating layer. The innovation is characterized by the presence of a Ni–Sn alloy layer between the Ni plating and the Au–Sn brazing material layer, which enhances the seal's integrity.

Career Highlights

Kusamori is currently employed at Tanaka Kikinzoku Kogyo K.K., a company known for its advancements in metal and material technologies. His work at the company has allowed him to focus on developing innovative sealing solutions that meet the demands of modern packaging.

Collaborations

Throughout his career, Kusamori has collaborated with talented individuals such as Kenichi Miyazaki and Tetsuya Nakamura. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Hiroyuki Kusamori is a distinguished inventor whose work in sealing technologies has led to significant advancements in packaging solutions. His innovative patents reflect his commitment to enhancing product reliability and functionality.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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