logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7495333 B1

PDFFull Text
Date of Patent:
Feb. 24, 2009

Filed:

May. 06, 2005

Seal cover structure comprising a nickel-tin (ni—sn) alloy barrier layer formed between a nickel (ni) plating layer and a gold-tin (au—sn) brazing layer having sn content of 20.65 to 25 wt % formed on the seal cover main body

Applicants:

Kenichi Miyazaki, Hiratsuka, JP;

Hiroyuki Kusamori, Hiratsuka, JP;

Inventors:

Kenichi Miyazaki, Hiratsuka, JP;

Hiroyuki Kusamori, Hiratsuka, JP;

Assignee:

Tanaka Kikinzoku Kogyo K.K., Tokyo, JP;

Attorney:

Roberts & Roberts, LLP

Primary Examiner:

Anh D Mai

Int. Cl.
CPC ...
H01L 23/10 (2006.01); B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A hermetic seal cover capable of inhibiting defects such as voids from generating in sealing a package, and a method of manufacturing the seal cover are provided. The hermetic seal cover comprises: a seal cover main body; a Ni plating layer applied onto a surface of the seal cover main body; and a Au—Sn brazing material layer fusion bonded to a surface of the Ni plating layer, and is characterized by a Ni—Sn ally layer disposed between the Ni plating layer and the Au—Sn brazing material layer. It is preferable if the Ni—Sn alloy layer has a thickness of 0.6-5.0 μm. It is also preferable if Au—Sn brazing material layer has a Sn content of 20.65-23.5 wt %.

Find Patent Forward Citations

Loading…