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For the Inventor, By the Inventor

Tsukuba, Japan

Hiroyuki Izawa

This inventor holds 6 USPTO granted patents. Top assignee: Hitachi Chemical Company, Ltd.. Active years: 2004-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroyuki Izawa. Retrieved from https://idiyas.com/inventor/hiroyuki-izawa-ei2rp0ld

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 6

% Patents Active = 50.0

Average Co-Inventor Count = 4.6

ph-index = 1

Forward Citations = 5(Granted Patents)


Location History:

  • Ibaraki-ken, JP (2004)
  • Tsukuba, JP (2007 - 2014)

Company Filing History:

goldMedal6 out of 1,641 
 
Hitachi Chemical Company, Ltd.
 patents

Years Active: 2004-2014

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6 patents (USPTO):Explore Patents
1. 8696942 - Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device (2014-04-15),
2. 8518303 - Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device (2013-08-27),
3. 8309658 - Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device (2012-11-13),
4. 8138268 - Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device (2012-03-20),
5. 7202283 - Method for dissolving saturated polyester solution for decomposing saturated polyester and method for decomposition using the same (2007-04-10),
6. 6780894 - Treatment liquid for cured unsaturated polyester resin and treatment method thereof (2004-08-24),

Title: Innovations of Hiroyuki Izawa

Introduction

Hiroyuki Izawa is a prominent inventor based in Tsukuba, Japan. He has made significant contributions to the field of materials science, particularly in adhesive compositions and semiconductor devices. With a total of six patents to his name, Izawa's work has had a considerable impact on various technological advancements.

Latest Patents

Izawa's latest patents include an innovative adhesive composition, a circuit connecting material, a connection structure of a circuit member, and a semiconductor device. The adhesive composition comprises a radical generator, a thermoplastic resin, and a urethane(meth)acrylate that contains two or more radical-polymerizing groups in the molecule. This composition has a weight-average molecular weight ranging from 3000 to 30,000, showcasing his expertise in developing advanced materials for electronic applications.

Career Highlights

Hiroyuki Izawa is currently associated with Hitachi Chemical Company, Ltd., where he continues to push the boundaries of innovation in his field. His work has not only contributed to the company's success but has also advanced the industry as a whole.

Collaborations

Izawa has collaborated with notable colleagues, including Shigeki Katogi and Houko Sutou. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Hiroyuki Izawa's contributions to adhesive compositions and semiconductor devices highlight his role as a leading inventor in Japan. His innovative patents and collaborations reflect his commitment to advancing technology and materials science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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