The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2012
Filed:
Nov. 17, 2011
Shigeki Katogi, Tsukuba, JP;
Houko Sutou, Hitachi, JP;
Hiroyuki Izawa, Tsukuba, JP;
Toshiaki Shirasaka, Tsukuba, JP;
Masami Yusa, Tsukuba, JP;
Takanobu Kobayashi, Chikusei, JP;
Shigeki Katogi, Tsukuba, JP;
Houko Sutou, Hitachi, JP;
Hiroyuki Izawa, Tsukuba, JP;
Toshiaki Shirasaka, Tsukuba, JP;
Masami Yusa, Tsukuba, JP;
Takanobu Kobayashi, Chikusei, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.