Company Filing History:
Years Active: 1986-2009
Title: Innovations of Hiroyuki Hamaguchi
Introduction
Hiroyuki Hamaguchi is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of technology, particularly in the area of semiconductor assembly. With a total of 5 patents to his name, Hamaguchi's work has had a considerable impact on the industry.
Latest Patents
One of his latest patents is a flip-chip type assembly designed to alleviate thermal stress between an LSI and a substrate. This innovative structure allows for easy detachment of the LSI from the substrate. In this assembly, an interposer made of silicon is placed between the device and the substrate. The LSI and the interposer are connected with solder, while the interposer and the substrate are connected with a conductive resin. This conductive resin effectively reduces thermal stress, enabling the LSI to be detached easily by heating the solder. The use of silicon for both the LSI and the interposer further minimizes thermal stress.
Career Highlights
Hamaguchi has worked with prominent companies such as NEC Corporation and Meiji Seika Kaisha, Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.
Collaborations
Hamaguchi has collaborated with notable colleagues, including Keisuke Nakayama and Tetsuya Nagata. Their joint efforts have further advanced the field of semiconductor assembly.
Conclusion
Hiroyuki Hamaguchi's contributions to technology through his patents and collaborations highlight his role as an influential inventor in the semiconductor industry. His innovative solutions continue to shape the future of electronic assembly.