Nec Corporation

Meiji Seika Kaisha, Ltd.

Hiroyuki Hamaguchi

Tetsuya Nagata

Keisuke Nakayama

Takeo Nomura

Osamu Makabe

Chuhei Nojiri

Kozo Nagaoka

Keita Matsunaga

Shinichiro Kuriya

Kiyoyuki Ogata

A structure for sufficiently alleviating the thermal stress between an LSI and substrate and allowing the LSI to be detached from a substrate easily is provided. In a flip-chip type assembly according to the present invention, an interposer made of silicon intervenes between the device and the substrate. The LSI and the interposer are connected with a solder and, the interposer and the substrate are connected with a conductive resin. The conductive resin alleviates the thermal stress between the substrate and the interposer. The LSI can be detached easily by heating the solder. The thermal stress between the LSI and the interposer can be reduced because both of them are made of silicon.

Flip-chip type assembly

Computer

Megakaryocyte colony stimulating factor and process for its preparation

A multilayer wiring substrate composed of organic dielectric layers with wiring layers disposed therein supports large-scale integrated circuit chips and bonding pads. To prevent damage to the wiring layers when wires from the integrated circuit chips are attached to the bonding pads by thermocompression bonding, a metallic layer is interposed between the wiring layers and the bonding pads.

Multilayer wiring substrate

Growing community of inventors

Tokyo, Japan

Hiroyuki Hamaguchi