The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 1986
Filed:
Dec. 06, 1984
Applicant:
Inventor:
Hiroyuki Hamaguchi, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; C25D / ; C25D / ;
U.S. Cl.
CPC ...
428209 ; 428901 ; 428660 ; 428666 ; 428671 ; 428670 ; 156297 ;
Abstract
A multilayer wiring substrate composed of organic dielectric layers with wiring layers disposed therein supports large-scale integrated circuit chips and bonding pads. To prevent damage to the wiring layers when wires from the integrated circuit chips are attached to the bonding pads by thermocompression bonding, a metallic layer is interposed between the wiring layers and the bonding pads.