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For the Inventor, By the Inventor

Tokyo, Japan

Hiroyuki Fukasawa

This inventor holds 15 USPTO granted patents and 1 published patent application and 1 EPO patent, primarily in Optoelectronics Packaging. Top assignees: Sony Corporation, Senju Metal Industry Co., Ltd.. Active years: 1993-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroyuki Fukasawa. Retrieved from https://idiyas.com/inventor/hiroyuki-fukasawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 15 

% Patents Active = 53.3


Average Co-Inventor Count = 2.0

ph-index = 8

Forward Citations = 187(Granted Patents)


Location History:

  • Oita, JP (1998 - 1999)
  • Tama, JP (1999)
  • Tokyo, JP (1993 - 2015)

Company Filing History:

goldMedal15 out of 58,148 
 
Sony Corporation
 patents
silverMedal1 out of 338 
 
Senju Metal Industry Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 1993-2015

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Areas of Expertise:
Optical Element
Light-Emitting Device
Thermal Conductive Member
Light Source Module
Display Apparatus
Semiconductor Device
Printed Wiring Board
Resin Molding
Soldering Flux
Electronic Device
Packaging Chips
Manufacturing Method
15 patents (USPTO):Explore Patents
1. 8962355 - Optical element package and method of manufacturing the same (2015-02-24),
2. 8654810 - Light-emitting device and method of manufacturing the same (2014-02-18),
3. 8619825 - Light-emitting device having a thermal conductive member with wiring function and method of manufacturing the same (2013-12-31),
4. 8158997 - Optical element package and method of manufacturing the same (2012-04-17),
5. 7878680 - Light source module, light source apparatus and liquid crystal display (2011-02-01),
6. 7728343 - Light source apparatus and display apparatus and white resist layer (2010-06-01),
7. 6992395 - Semiconductor device and semiconductor module having external electrodes on an outer periphery (2006-01-31),
8. 5973931 - Printed wiring board and electronic device using same (1999-10-26),
9. 5932030 - Flux for soldering using solder preforms (1999-08-03),
10. 5882692 - Resin molding apparatus (1999-03-16),
11. 5844782 - Printed wiring board and electronic device using same (1998-12-01),
12. 5650177 - Resin molding apparatus (1997-07-22),
13. 5289033 - Packaging of semiconductor chips with resin (1994-02-22),
14. 5268532 - Semiconductor device (1993-12-07),
15. 5214846 - Packaging of semiconductor chips (1993-06-01),

Title: The Innovative Journey of Hiroyuki Fukasawa

Introduction: Hiroyuki Fukasawa is a renowned inventor hailing from Tokyo, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hiroyuki Fukasawa holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Fukasawa has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant advancements in various industries.

Collaborations: Throughout his career, Hiroyuki Fukasawa has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge exchange.

Conclusion: Hiroyuki Fukasawa's passion for pushing the boundaries of technology and his relentless pursuit of innovation have solidified his reputation as a visionary inventor in the global tech community.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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