Company Filing History:
Years Active: 2017-2024
Title: Hiroyuki Fujishima: Innovator in Semiconductor Packaging
Introduction
Hiroyuki Fujishima is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His innovative work focuses on enhancing the efficiency and effectiveness of semiconductor devices.
Latest Patents
Fujishima's latest patents include a chip-middle type fan-out panel-level package and a semiconductor package with a manufacturing method. The chip-middle type fan-out panel-level package features a routing layer and a polyimide layer designed to control warpage, ensuring that the height of the package remains consistent. This design allows for a more compact and efficient semiconductor package. The second patent describes a semiconductor package that includes an insulating layer, a chip, and a thermal interface material, which enhances heat dissipation and overall performance.
Career Highlights
Hiroyuki Fujishima is currently employed at Powertech Technology Inc., a leading company in the semiconductor packaging industry. His work has been instrumental in advancing packaging technologies that are crucial for modern electronic devices.
Collaborations
Fujishima has collaborated with notable colleagues such as Shang-Yu Chang-Chien and Shou-Chian Hsu, contributing to various projects that push the boundaries of semiconductor technology.
Conclusion
Hiroyuki Fujishima's innovative contributions to semiconductor packaging demonstrate his expertise and commitment to advancing technology in this critical field. His patents reflect a deep understanding of the challenges in semiconductor design and manufacturing, paving the way for future advancements.