This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Shinryo Corporation. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Hirotoshi Nishi: Innovator in Low Melting-Point Bonding Technology
Introduction
Hirotoshi Nishi is a prominent inventor based in Kitakyushu, Japan. He is known for his innovative contributions to the field of semiconductor technology. His work focuses on developing low melting-point bonding members that enhance the efficiency and reliability of electronic circuits.
Latest Patents
Hirotoshi Nishi holds a patent for a low melting-point bonding member, which includes a low melting-point alloy containing Bi, In, and Sn. The alloy composition consists of Bi at 46 mass % or more and 72 mass % or less, In at 26 mass % or more and 54 mass % or less, and Sn at 2 mass % or less, with a melting point ranging from 86 to 111° C. This invention also includes a method for producing the bonding member through a plating process that ensures the desired alloy composition.
Career Highlights
Hirotoshi Nishi is currently employed at Shinryo Corporation, where he continues to advance his research and development efforts. His work has significantly impacted the semiconductor industry, particularly in improving the performance of electronic circuits.
Collaborations
Hirotoshi has collaborated with notable colleagues, including Takeshi Sawai and Kenichirou Shirokawa, to further enhance the innovations in his field.
Conclusion
Hirotoshi Nishi's contributions to low melting-point bonding technology exemplify his commitment to innovation in the semiconductor industry. His patent and ongoing work at Shinryo Corporation highlight his role as a key inventor in this specialized area.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile