The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2025
Filed:
Aug. 27, 2021
Shinryo Corporation, Kitakyushu, JP;
Hirotoshi Nishi, Kitakyushu, JP;
Takeshi Sawai, Kitakyushu, JP;
Kenichirou Shirokawa, Kitakyushu, JP;
Souichirou Omae, Kitakyushu, JP;
SHINRYO CORPORATION, Kitakyushu, JP;
Abstract
A low melting-point bonding member includes a low melting-point alloy containing Bi: 46 mass % or more and 72 mass % or less, In: 26 mass % or more and 54 mass % or less, and Sn: 2 mass % or less when a total amount of Bi, In, and Sn is 100 mass % and having a melting point of 86 to 111° C. A method for producing a low melting-point bonding member, including a plating step of performing a plating process including at least Bi plating and In plating and forming, on an object to be plated, a plating layer containing Bi: 46 mass % or more and 72 mass % or less, In: 26 mass % or more and 54 mass % or less, and Sn: 2 mass % or less when a total amount of Bi, In, and Sn is 100 mass %.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile