Hiroshi Yanase

Title: Hiroshi Yanase: Innovator in Electronic Device Encapsulation

Introduction

Hiroshi Yanase is a notable inventor based in Yokohama, Japan. He has made significant contributions to the field of electronic device encapsulation. With a total of 2 patents to his name, Yanase's work focuses on enhancing the durability and functionality of electronic devices.

Latest Patents

Yanase's latest patents include innovative methods for encapsulating electronic devices. One of his patents describes an encapsulation process using a synthetic thermoplastic resin compound that combines polyphenylene sulfide and a filler in a specific ratio. This method utilizes a transfer molding or injection molding process to achieve optimal results. Another patent details the creation of a moldable polyphenylenesulfide through heat treatment of a partially crosslinked or noncrosslinked polyphenylenesulfide at elevated temperatures in an oxygen-deficient atmosphere.

Career Highlights

Hiroshi Yanase is currently employed at Asahi Glass Company, Limited, where he continues to develop cutting-edge technologies. His work has been instrumental in advancing the capabilities of electronic devices, making them more reliable and efficient.

Collaborations

Throughout his career, Yanase has collaborated with talented individuals such as Fukuo Kanno and Takeshi Abe. These partnerships have fostered innovation and contributed to the success of their projects.

Conclusion

Hiroshi Yanase is a distinguished inventor whose work in electronic device encapsulation has led to significant advancements in the industry. His innovative patents and collaborations reflect his commitment to enhancing technology.