The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 1983
Filed:
Jun. 04, 1981
Applicant:
Inventors:
Assignee:
Asahi Glass Company, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
26427211 ; 26427217 ; 26427218 ; 26427219 ; 26432818 ; 26433112 ; 525474 ; 525523 ; 525534 ; 525537 ;
Abstract
An encapsulation of an electronic device is carried out by using a synthetic thermoplastic resin compound having low viscosity in a molding condition which comprises polyphenylene sulfide and a filler at a ratio of 1:4 to 4:1 and a tacky or adhesive polymer at a ratio of 0.1 to 50 wt. parts per 100 wt. parts of polyphenylene sulfide by a transfer molding process or an injection molding process.