Hiroshi Wada

Title: Hiroshi Wada: Innovator in Multilayer Wiring Technology

Introduction

Hiroshi Wada is a prominent inventor based in Hitachinaka, Japan. He has made significant contributions to the field of electrical engineering, particularly in the development of multilayer wiring boards and electroconductive materials. With a total of 6 patents to his name, Wada's innovations have had a lasting impact on the industry.

Latest Patents

One of Wada's latest patents is for a multilayer wiring board that features a strip structure. This design includes a core material with a ground pattern on one side of an insulating layer and a strip line on the other side. Additionally, a prepreg is placed on the strip line of the core material, with a ground pattern also disposed on the prepreg. The core material is made from a high frequency-adaptive base material, while the prepreg is created from a general-purpose material. Another notable patent involves an electric circuit device that utilizes electroconductive composite metal powders. These powders consist of flat non-noble metal powders, each covered with a noble metal, which enhances their electroconductivity and prevents migration.

Career Highlights

Hiroshi Wada has worked with several reputable companies throughout his career. Notably, he has been associated with Hitachi Chemical Company, Ltd. and Kansai Matec Co., Ltd. His work in these organizations has allowed him to refine his expertise and contribute to groundbreaking innovations in the field.

Collaborations

Wada has collaborated with several notable individuals in his field, including Hideji Kuwajima and Shozo Yamana. These collaborations have fostered an environment of innovation and have led to the development of advanced technologies.

Conclusion

Hiroshi Wada's contributions to multilayer wiring technology and electroconductive materials have established him as a key figure in electrical engineering. His patents reflect a commitment to innovation and excellence in his field.