The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 1998
Filed:
Feb. 08, 1996
Keizo Hirai, Hitachiota, JP;
Hiroshi Wada, Hitachinaka, JP;
Akihiro Sasaki, Hitachi, JP;
Hisashi Kaga, Hakodate, JP;
Junichi Kikuchi, Hitachi, JP;
Shozo Yamana, Hitachi, JP;
Hideji Kuwajima, Hitachinaka, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Technopolis Hakodate Industrial Technology, Hokkaido, JP;
Abstract
Electroconductive composite metal powders comprising flat non-noble metal powders, each covered with a noble metal in an amount of 2 to 30% by weight in average based on the weight of the non-noble metal powders, on 50% or more in average of the whole surface area of the non-noble metal powders, interposing a layer of a mixture of the non-noble metal and noble metal between each non-noble metal powder and a noble metal covering layer, are suitable for providing an electroconductive paste after mixing with a binder, said paste showing excellent electroconductivity and prevention of migration.