Hitachi Chemical Company, Ltd.

Kansai Matec Co., Ltd.

Technopolis Hakodata Industrial Technology Promotion Organization

Technopolis Hakodate Industrial Technology

Hiroshi Wada

Hideji Kuwajima

Shozo Yamana

Junichi Kikuchi

Hiroaki Tanaka

Akihiro Sasaki

Keizo Hirai

Hideki Nakamura

Yoshihiko Imai

Akihito Iwai

Sosuke Naito

Hisashi Kaga

Katsumi Matsumoto

Yoshikatsu Mikami

Masahiro Katou

Hisashi Dokochi

Yasuyuki Koshikawa

Toshikazu Ono

A multilayer wiring board has a strip structure comprising a core material in which a ground pattern is disposed on one side of an insulating layer and a strip line is disposed on the other side, a prepreg disposed on the strip line of the core material, and a ground pattern disposed on the prepreg. In this multilayer wiring board, the core material is formed with a high frequency-adaptive base material, and the prepreg is formed with a general-purpose material.

Multilayer wiring board

Electroconductive composite metal powders comprising flat non-noble metal powders, each covered with a noble metal in an amount of 2 to 30% by weight in average based on the weight of the non-noble metal powders, on 50% or more in average of the whole surface area of the non-noble metal powders, interposing a layer of a mixture of the non-noble metal and noble metal between each non-noble metal powder and a noble metal covering layer, are suitable for providing an electroconductive paste after mixing with a binder, said paste showing excellent electroconductivity and prevention of migration.

Electric circuit device having circuit conductors using an

An alumina-zirconia sintered body comprising 92 to 35% by weight of aluminum oxide and 8 to 65% by weight of zirconium oxide having mainly tetragonal system, and 0.2 to 5 parts by weight of silicon oxide per 100 parts by weight of the total of aluminum oxide and zirconium oxide, and having a relative density of 95% or more, has improved wear resistance and suitable for use in an impact grinder.

Alumina-zirconia sintered body, production thereof, and impact grinder

Composite electroconductive powder, electroconductive paste, process for

Electroconductive paste

Growing community of inventors

Hitachinaka, Japan

Hiroshi Wada