Company Filing History:
Years Active: 2001
Title: Hiroshi Shibaya: Innovator in Wafer Polishing Technology
Introduction
Hiroshi Shibaya is a notable inventor based in Omiya, Japan. He has made significant contributions to the field of wafer polishing technology, holding a total of 2 patents. His work focuses on improving the efficiency and effectiveness of wafer polishing processes, which are crucial in semiconductor manufacturing.
Latest Patents
Shibaya's latest patents include an "Apparatus and method for dressing a wafer polishing pad" and a "Wafer polishing apparatus and wafer manufacturing method." The first patent describes an apparatus that includes a disk-shaped dresser, an arm, and a control unit. This apparatus is designed to dress a wafer polishing pad by pressing the dresser against the rotating pad, ensuring optimal performance through frictional force. The second patent outlines a wafer polishing apparatus that enhances the uniformity of polishing wafer surfaces. It features a head body, a diaphragm, and a carrier that holds the wafer, all designed to prevent excessive polishing at the wafer's outer edges.
Career Highlights
Hiroshi Shibaya is currently employed at Mitsubishi Materials Corporation, where he continues to innovate in the field of wafer polishing technology. His work has been instrumental in advancing the methods used in semiconductor manufacturing, contributing to the overall efficiency of the industry.
Collaborations
Shibaya has collaborated with notable coworkers such as Kanji Hosoki and Masahito Komasaki. Their combined expertise has furthered the development of innovative solutions in wafer polishing technology.
Conclusion
Hiroshi Shibaya's contributions to wafer polishing technology through his patents and work at Mitsubishi Materials Corporation highlight his role as a key innovator in the semiconductor industry. His inventions continue to influence the efficiency of wafer manufacturing processes.