Toyoma, Japan

Hiroshi Saegusa



Average Co-Inventor Count = 2.7

ph-index = 1

Forward Citations = 6(Granted Patents)


Location History:

  • Nagano, JP (2006)
  • Toyoma, JP (2020)

Company Filing History:


Years Active: 2006-2020

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2 patents (USPTO):Explore Patents

Title: Hiroshi Saegusa: Innovator in Abrasive Materials

Introduction

Hiroshi Saegusa is a notable inventor based in Toyoma, Japan. He has made significant contributions to the field of abrasive materials, holding a total of 2 patents. His work focuses on enhancing the efficiency and quality of polishing processes, particularly in the electronics industry.

Latest Patents

Saegusa's latest patents include a cerium-based abrasive material and a method for producing polishing particles. The cerium-based abrasive is designed to achieve a high polishing rate while minimizing surface defects such as scratches and pits. This innovative abrasive comprises a cubic composite rare earth oxide and a composite rare earth oxyfluoride, containing a specific range of rare earth elements. The formulation allows for low-cost production with high efficiency, making it ideal for polishing glass substrates. Additionally, his method for producing polishing particles emphasizes achieving a high removal rate and a superior surface quality during the polishing of electronic substrates.

Career Highlights

Throughout his career, Hiroshi Saegusa has worked with prominent companies, including Showa Denko Kabushiki Kaisha and Showa Denko K.K. His experience in these organizations has contributed to his expertise in developing advanced abrasive materials.

Collaborations

Saegusa has collaborated with notable colleagues such as Tomoyuki Masuda and Katsura Ito. These partnerships have likely enriched his research and development efforts in the field of abrasives.

Conclusion

Hiroshi Saegusa's innovative work in abrasive materials has positioned him as a key figure in the industry. His patents reflect a commitment to improving polishing processes, which are essential in various applications, particularly in electronics.

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