The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2006
Filed:
Dec. 12, 2001
Katsura Ito, Nagano, JP;
Hiroshi Saegusa, Nagano, JP;
Tomoyuki Masuda, Nagano, JP;
Fumio Imai, Nagano, JP;
Katsura Ito, Nagano, JP;
Hiroshi Saegusa, Nagano, JP;
Tomoyuki Masuda, Nagano, JP;
Fumio Imai, Nagano, JP;
Showa Denko Kabushiki Kaisha, Tokyo, JP;
Abstract
By providing an abrasive having a ratio of volume-cumulative (95%) average particle size (D95) to volume-cumulative (50%) average particle size (D50) (D95/D50) falling within a range of 1.2 to 3.0 or an abrasive having a volume-cumulative (95%) average particle size (D95) falling within a range of 0.1-1.5 μm and containing coarse particles having a size more than 10 times the volume-cumulative (50%) average particle size (D50) in an amount, based on the total mass of all the particles, of 1 mass % or less, there can be provided an abrasive, an abrasive slurry, a method for producing an abrasive, and a polishing method which attain, during accurate polishing of substrates such as electronics substrates, a high removal rate and a high-quality surface; i.e., a surface having a high flatness, low surface roughness, and substantially no microscratches or micropits.