Hiroshi Ozaki

Title: Hiroshi Ozaki: Innovator in Semiconductor Technology

Introduction

Hiroshi Ozaki is a notable inventor based in Kokubunji, Japan. He has made significant contributions to the field of semiconductor technology, holding three patents that showcase his innovative spirit and technical expertise.

Latest Patents

Ozaki's latest patents include advancements in semiconductor devices and processes for producing them. One of his notable inventions focuses on improving the adhesion of inner leads with packaging resin in resin-sealed semiconductor devices. This is achieved by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet, thereby extending the lengths of the inner leads on or under the pellet. Another patent emphasizes a semiconductor device that features inner leads extending over a surface of a pellet, further enhancing the adhesion with the packaging resin.

Career Highlights

Throughout his career, Hiroshi Ozaki has worked with prominent companies such as Hitachi, Ltd. and Hitachi VLSI Engineering Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Ozaki has collaborated with talented individuals in his field, including Takayuki Okinaga and Hiroshi Tachi. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Hiroshi Ozaki's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in semiconductor devices, showcasing the importance of innovation in technology.