The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 1992
Filed:
May. 29, 1990
Applicant:
Inventors:
Takayuki Okinaga, Akishima, JP;
Hiroshi Tachi, Akishima, JP;
Hiroshi Ozaki, Kokubunji, JP;
Kanji Otsuka, Higashiyamato, JP;
Michiaki Furukawa, Mizuho, JP;
Yasuyuki Yamasaki, Kokubunji, JP;
Assignees:
Hitachi, Ltd., Tokyo, JP;
Hitachi VLSI Engineering Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 70 ; 357 68 ;
Abstract
According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.