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For the Inventor, By the Inventor

Kawasaki, Japan

Hiroshi Orikabe

This inventor holds 7 USPTO granted patents and 1 published patent application. Top assignee: Ajinomoto Co., Ltd.. Active years: 2000-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroshi Orikabe. Retrieved from https://idiyas.com/inventor/hiroshi-orikabe

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7 

% Patents Active = 85.7

Average Co-Inventor Count = 1.8

ph-index = 4

Forward Citations = 37(Granted Patents)


Company Filing History:

goldMedal7 out of 1,953 
 
Ajinomoto Co., Ltd.
 patents

Years Active: 2000-2007

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7 patents (USPTO):Explore Patents
1. 7282257 - Resin composition and adhesive film for multi-layered printing wiring board (2007-10-16),
2. 6818702 - Thermosetting resin composition and flexible circuit overcoating material comprising the same (2004-11-16),
3. 6433123 - Curable resin composition for overcoat of flexible circuit (2002-08-13),
4. 6380343 - Curable resin composition for overcoat of flexible circuit (2002-04-30),
5. 6335417 - Modified polyimide resin and thermosetting resin composition containing the same (2002-01-01),
6. 6232426 - Epoxy resin composition (2001-05-15),
7. 6162889 - Curable resin composition for overcoat of flexible circuit (2000-12-19),

Title: Hiroshi Orikabe: Innovator in Resin Compositions and Adhesive Films

Introduction

Hiroshi Orikabe is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of resin compositions and adhesive films, holding a total of 7 patents. His work focuses on enhancing the mechanical strength and functionality of multi-layered printed wiring boards.

Latest Patents

One of his latest patents is for a resin composition and adhesive film for multi-layered printing wiring boards. This invention relates to resin compositions that are useful for preparing adhesive films, which are essential for forming interlayer insulation layers. These layers exhibit excellent mechanical strength and can be roughened by an oxidizing agent. Another notable patent is for a thermosetting resin composition and flexible circuit overcoating material. This composition serves as an epoxy resin-based overcoating agent for flexible circuit boards, providing essential properties such as excellent adhesiveness, electric insulation, chemical resistance, and thermal resistance.

Career Highlights

Hiroshi Orikabe is associated with Ajinomoto Co., Ltd., where he continues to innovate and develop new materials. His work has significantly impacted the electronics industry, particularly in the production of reliable and efficient circuit boards.

Collaborations

He has collaborated with notable coworkers, including Tadahiko Yokota and Kiyomiki Hirai, contributing to various projects that enhance the functionality of electronic components.

Conclusion

Hiroshi Orikabe's contributions to resin compositions and adhesive films have established him as a key figure in the field of electronics. His innovative patents continue to influence the development of advanced materials for multi-layered printed wiring boards.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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