The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2007
Filed:
Jun. 25, 2004
Applicants:
Hiroshi Orikabe, Kawasaki, JP;
Kenji Kawai, Kawasaki, JP;
Inventors:
Hiroshi Orikabe, Kawasaki, JP;
Kenji Kawai, Kawasaki, JP;
Assignee:
Ajinomoto Co., Inc., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention relates to resin compositions that are useful for preparing adhesive films, which are, in turn, useful for forming interlayer insulation layers for multi-layered printed wiring boards having an excellent mechanical strength and capable of being roughened by an oxidizing agent.
Orikabe, Hiroshi. (2007). Resin composition and adhesive film for multi-layered printing wiring board (U.S. Patent No. 7282257). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7282257
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile