Hiroshi Okoshi

Title: Hiroshi Okoshi: Innovator in Curable Resin Composition

Introduction

Hiroshi Okoshi is a notable inventor based in Settsu, Japan. He has made significant contributions to the field of curable resin compositions, with a focus on developing materials that exhibit low linear expansion coefficients. His innovative work has led to the filing of multiple patents, showcasing his expertise and dedication to advancing technology.

Latest Patents

Hiroshi Okoshi holds 2 patents related to curable resin compositions. His latest inventions include a curable resin composition, a curable resin composition tablet, a molded body, a semiconductor package, a semiconductor component, and a light-emitting diode. The primary aim of these inventions is to provide a curable resin composition that results in a cured product with a low linear expansion coefficient. The essential components of his curable resin composition include an organic compound with multiple carbon-carbon double bonds, a compound with SiH groups, a hydrosilylation catalyst, a silicone compound, and an inorganic filler.

Career Highlights

Hiroshi Okoshi is currently associated with Kaneka Corporation, where he continues to innovate and develop new materials. His work has been instrumental in enhancing the performance and reliability of semiconductor components and other applications.

Collaborations

Hiroshi has collaborated with notable coworkers such as Tadashi Kokubo and Katsuya Ouchi, contributing to a dynamic and innovative work environment.

Conclusion

Hiroshi Okoshi's contributions to the field of curable resin compositions highlight his role as a leading inventor in Japan. His innovative patents and ongoing work at Kaneka Corporation continue to influence advancements in technology.