The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Mar. 30, 2011
Tadashi Kokubo, Osaka, JP;
Katsuya Ouchi, Settsu, JP;
Takahisa Iwahara, Settsu, JP;
Kazuhiko Hirabayashi, Settsu, JP;
Hiroshi Okoshi, Settsu, JP;
Tomokazu Tozawa, Settsu, JP;
Shuhei Ozaki, Settsu, JP;
Tadashi Kokubo, Osaka, JP;
Katsuya Ouchi, Settsu, JP;
Takahisa Iwahara, Settsu, JP;
Kazuhiko Hirabayashi, Settsu, JP;
Hiroshi Okoshi, Settsu, JP;
Tomokazu Tozawa, Settsu, JP;
Shuhei Ozaki, Settsu, JP;
KANEKA CORPORATION, Osaka, JP;
Abstract
The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.