Hiroshi Odaira

Title: Hiroshi Odaira: Innovator in IC Package Technology

Introduction

Hiroshi Odaira is a prominent inventor based in Chigasaki, Japan. He has made significant contributions to the field of integrated circuit (IC) packaging, holding a total of 9 patents. His innovative designs have paved the way for advancements in multilayer wiring boards and flexible wiring sheets.

Latest Patents

One of his latest patents is focused on a multilayer wiring board and the method for forming the same. This patent describes an IC package that features a flexible wiring sheet, which includes an upper portion, a lower portion, and a side portion that wraps around a base member. The design allows for an IC to be loaded on the upper surface of the flexible wiring sheet, connecting it to an electrode on the upper lead pattern. The lead pattern extends from the upper to the lower flexible wiring sheet, ensuring efficient connectivity and functionality.

Career Highlights

Throughout his career, Hiroshi Odaira has worked with notable companies such as Toshiba Corporation and Yamaichi Electronics Co., Ltd. His experience in these organizations has contributed to his expertise in the field of electronics and IC packaging.

Collaborations

Hiroshi has collaborated with esteemed colleagues, including Eiji Imamura and Kenji Sasaoka. Their combined efforts have led to advancements in technology and innovation within the industry.

Conclusion

Hiroshi Odaira's contributions to IC packaging technology and his impressive portfolio of patents highlight his role as a key innovator in the field. His work continues to influence the development of advanced electronic components.