Kabushiki Kaisha Toshiba

Yamaichi Electronics Co., Ltd.

Tokyo Shibaura Denki Kabushiki Kaisha

Hiroshi Odaira

Takahiro Mori

Kenji Sasaoka

Yoshizumi Sato

Fumitoshi Ikegaya

Eiji Imamura

Yuichi Yamamoto

Atsuko Iida

Yusuke Wada

Etsuji Suzuki

Yasushi Arai

Sadao Kowatari

Akira Yonezawa

Shunichi Nakajima

Hidehisa Yamazaki

Madoka Fujiwara

Multilayer wiring board and method for forming the same

An IC package is provided that has a flexible wiring sheet, including an upper portion, a lower portion and a side portion which is wound around a base member over an upper surface, side surfaces and a lower surface of the base member. An IC is loaded on an upper surface of the upper flexible wiring sheet covering the upper surface of the base member. The IC is connected to an electrode provided on an upper lead pattern portion laid along the upper surface of the flexible wiring sheet. The lead pattern is extended from the upper flexible wiring sheet to the lower flexible wiring sheet via the side surfaces of the flexible wiring sheet covering side surfaces of the base member. An electrode to be connected with an object is arranged on the lower lead pattern portion which is formed on the lower flexible wiring sheet, and overall the IC or an IC connection portion is sealed on the upper surface of the upper flexible wiring sheet.

IC package having a single wiring sheet with a lead pattern disposed

A contact converting structure of a semiconductor chip comprises a semiconductor chip with a group of electrodes arranged on a surface of one side thereof. A liquid crystal polymer film is bonded to the surface in such a manner as to cover the electrodes group, and a group of external contacts is arranged on the other surface of the semiconductor chip. The external contacts group is connected to the electrodes group through the liquid crystal polymer film. A process for manufacturing a semiconductor chip having such a contact converting structure is also disclosed.

Contact converting structure of semiconductor chip and process for

A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet. Moreover, the conductive bumps can be properly electrically connected to an opposed conductive layer. Thus, the circuit component provides high reliability and contributes to high yield and fabrication efficiency.

Circuit devices and fabrication Method of the same

A supporting member or first synthetic resin sheet with conductive bumps disposed at predetermined positions are superposed on a second synthetic resin sheet under the condition that the resin component of the second synthetic resin sheet is plastic deformed or the temperature thereof exceeds a glass transition temperature so that the conductive bumps are pierced into the second synthetic resin sheet. In other words, the conductive bumps are pierced vertically into the second synthetic resin sheet so as to form through-type conducive lead portions exposed to the first (supporting substrate) and second synthetic resin sheets. The through-type conductive lead portions are used to electrically connect electric devices and circuit and to connect wiring pattern layers. The conductive bumps can be precisely and densely formed and disposed by printing method or plating method. The conductive bumps can be pushed and pierced into the second synthetic resin sheet. Moreover, the conductive bumps can be properly electrically Connected to an opposed conductive layer. Thus, the circuit component provides high reliability and contributes to high yield and fabrication efficiency.

Circuit devices and fabrication method of the same

A multi-layer wiring board where a plurality of wiring boards are laminated. The wiring board comprises a flexible insulating layer having a through hole and a wiring pattern formed on the flexible insulating layer. The wiring pattern is composed at least of two conductive layers. The first conductive layer formed on the insulating layer is made of a non-metallic conductor and the first wiring pattern is formed by a laser beam. The second conductive layer is an electroplated layer formed on the first wiring pattern. The first and second conductive layers have different reflectance for a beam. The wiring board is manufactured by integrally laminating a plastic conductive supporting plate wound in a roll shape and an insulating film similarly wound in a roll shape; forming a through hole in a predetermined position of the insulating film; forming the first conductive layer on the laminated body provided with the through hole; forming the first wiring pattern by a laser beam; and forming the electroplated layer on the first wiring pattern.

Wiring boards and manufacturing methods thereof

Small projections are arranged on a molding surface of at least one of an upper die half and a lower die half constituting a molding die, and a predetermined number of conductor circuits each including small projections are formed on the molding surface by electrically plating. A predetermined number of conductor circuits are formed on the molding surface of other die half in the same manner. Subsequently, the molding surfaces of both the die halves are brought in pressure contact with each other so that the electrically plated layers each including small projections on the molding surface are connected electrically. Thereafter, the hollow space between both the die halves is filled with a predetermined resin, whereby the conductor circuits are reversely secured to the resultant molded product to complete production of a three-dimensional wiring board. After electronic components are assembled on the three-dimensional wiring board, the resin is removed from the molded product by dissolving the resin. Consequently, a hollow three-dimensional wiring structure is formed. Thus, three-dimensional conductor circuits which are electrically connected to each other at predetermined positions are formed on the front and rear surfaces of molded product. Thus, the three-dimensional wiring board can be produced at a high efficiency without any necessity for complicated steps and actuation. An electronic circuit module produced by assembling electronic components on the three-dimensional wiring board assures that signals can be processed at a high speed.

Method of producing a three-dimensional wiring board

An electronic duplicator machine heats a toner attached to a copying paper and a fixing device fixes the toner to the paper. The fixing device includes a heat generating roller which includes a supporting body having a journal portion on either end surface and rotatably supported by the journal portion; a heat insulating layer formed on the outer circumferential surface of the supporting body to prevent the transmission of heat to the supporting body; a resistance heater layer through which a current flows to heat the toner and which covers the outer circumferential surface of the heat insulating layer.

Growing community of inventors

Chigasaki, Japan

Hiroshi Odaira