Himeji, Japan

Hiroshi Manabe

This inventor holds 3 USPTO granted patents. Top assignees: Sumitomo Seika Chemicals Co., Ltd., Other. Active years: 2002-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroshi Manabe. Retrieved from https://idiyas.com/inventor/hiroshi-manabe-6rold3at

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 66.7

Average Co-Inventor Count = 4.6

ph-index = 3

Forward Citations = 30(Granted Patents)


Location History:

  • Himeji, JP (2002 - 2004)
  • Hyogo, JP (2004)

Company Filing History:


Years Active: 2002-2004

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3 patents (USPTO):Explore Patents

Title: Hiroshi Manabe: Innovator in Polyamide Resin Technology

Introduction

Hiroshi Manabe is a notable inventor based in Himeji, Japan. He has made significant contributions to the field of polyamide resin technology, holding a total of 3 patents. His work focuses on the development of innovative materials and processes that enhance the performance of adhesives and dispersions.

Latest Patents

Hiroshi Manabe's latest patents include an aqueous polyamide resin dispersion and a process for producing adhesive for fusion bonding. The aqueous dispersion of polyamide resin comprises dispersed polyamide resin particles, a basic material, and water. The dispersed polyamide resin particles have a weight-average diameter ranging from 0.1 to 10 micrometers. The ratio of end carboxyl groups to end amino groups in the polyamide resin is maintained between 60/40 and 100/0. The amount of basic material added is between 0.2 and 3.0 mol per mol of end carboxyl groups. This innovative aqueous dispersion can be manufactured by adding the polyamide resin to an aqueous dispersion medium containing the specified amount of basic material.

Additionally, his process for producing adhesive for fusion bonding involves heating a thermoplastic resin to a temperature above its softening point and dispersing it in an aqueous medium. This process includes applying shear force to the aqueous medium by stirring until the thermoplastic resin is divided into particles with a weight-average particle size of 0.1 to 20 micrometers.

Career Highlights

Hiroshi Manabe has worked with Sumitomo Seika Chemicals Co., Ltd., where he has contributed to advancements in chemical engineering and material science. His expertise in polyamide resins has positioned him as a key figure in the development of innovative adhesive technologies.

Collaborations

Throughout his career, Hiroshi has collaborated with notable professionals in the field, including Eiichi Araki and Norihiro Sugihara. These collaborations have further enriched his research and development efforts.

Conclusion

Hiroshi Manabe's contributions to polyamide resin technology and adhesive processes highlight his innovative spirit and dedication to advancing material science. His patents reflect a commitment to creating effective solutions in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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