The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2004
Filed:
Jan. 11, 2002
Applicant:
Inventors:
Eiichi Araki, Himeji, JP;
Norihiro Sugihara, Himeji, JP;
Kaichiro Nakao, Himeji, JP;
Hiroshi Manabe, Himeji, JP;
Tooru Takei, Sanda, JP;
Assignee:
Sumitomo Seika Chemicals Co., Ltd., Hyogo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D03D 1/500 ;
U.S. Cl.
CPC ...
D03D 1/500 ;
Abstract
A heat-fusion bonding adhesive is prepared by heating a thermoplastic resin to a temperature of no less than the softening temperature of the resin and then dispersing the resin in the softened state in an aqueous medium. Dispersing the thermoplastic resin in the aqueous medium is conducted, for example, by applying a shear force to the aqueous medium by stirring. In this case, stirring of the aqueous medium is preferably conducted till the thermoplastic resin is divided into particles with a weight-average particle size of 0.1-20 &mgr;m.