Company Filing History:
Years Active: 1993-2003
Title: Innovations by Hiroshi Kono
Introduction
Hiroshi Kono is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on enhancing the reliability and efficiency of semiconductor packages and circuit boards.
Latest Patents
One of Kono's latest patents is for a semiconductor package and production method that improves moisture resistance and reliability. This innovation includes a solder resist applied in an appropriate thickness between the electrodes of conductor circuits on a substrate's surface. The solder resist is patterned by removing unnecessary portions under laser irradiation, ensuring optimal performance. Another notable patent involves a method for manufacturing a printed circuit board that eliminates residue from the carbide of resin on the copper foil surface after boring a blind hole with a laser beam. This method allows for precise laser drilling through an insulator to reach the copper foil beneath, enhancing the board's functionality.
Career Highlights
Hiroshi Kono has built a successful career at Canon Kabushiki Kaisha, where he has been instrumental in developing cutting-edge technologies. His expertise in semiconductor packaging and circuit board manufacturing has positioned him as a key figure in the industry.
Collaborations
Kono has collaborated with notable colleagues, including Yasushi Taniguchi and Takashi Watanabe, to advance their shared goals in innovation and technology development.
Conclusion
Hiroshi Kono's contributions to semiconductor technology and circuit board manufacturing demonstrate his commitment to innovation. His patents reflect a deep understanding of the challenges in the field and a dedication to improving product reliability and efficiency.