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For the Inventor, By the Inventor

Yokohama, Japan

Hiroshi Kono

This inventor holds 5 USPTO granted patents. Top assignee: Canon Kabushiki Kaisha. Active years: 1993-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroshi Kono. Retrieved from https://idiyas.com/inventor/hiroshi-kono-sp9intkj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 5

Forward Citations = 109(Granted Patents)


Company Filing History:

goldMedal5 out of 93,085 
 
Canon Kabushiki Kaisha
 patents

Years Active: 1993-2003

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5 patents (USPTO):Explore Patents
1. 6531766 - Semiconductor package and production method thereof (2003-03-11),
2. 6346678 - Circuit board and method of manufacturing a circuit board (2002-02-12),
3. 6221690 - Semiconductor package and production method thereof (2001-04-24),
4. 5682187 - Method for manufacturing an ink jet head having a treated surface, ink (1997-10-28),
5. 5208604 - Ink jet head and manufacturing method thereof, and ink jet apparatus (1993-05-04),

Title: Innovations by Hiroshi Kono

Introduction

Hiroshi Kono is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on enhancing the reliability and efficiency of semiconductor packages and circuit boards.

Latest Patents

One of Kono's latest patents is for a semiconductor package and production method that improves moisture resistance and reliability. This innovation includes a solder resist applied in an appropriate thickness between the electrodes of conductor circuits on a substrate's surface. The solder resist is patterned by removing unnecessary portions under laser irradiation, ensuring optimal performance. Another notable patent involves a method for manufacturing a printed circuit board that eliminates residue from the carbide of resin on the copper foil surface after boring a blind hole with a laser beam. This method allows for precise laser drilling through an insulator to reach the copper foil beneath, enhancing the board's functionality.

Career Highlights

Hiroshi Kono has built a successful career at Canon Kabushiki Kaisha, where he has been instrumental in developing cutting-edge technologies. His expertise in semiconductor packaging and circuit board manufacturing has positioned him as a key figure in the industry.

Collaborations

Kono has collaborated with notable colleagues, including Yasushi Taniguchi and Takashi Watanabe, to advance their shared goals in innovation and technology development.

Conclusion

Hiroshi Kono's contributions to semiconductor technology and circuit board manufacturing demonstrate his commitment to innovation. His patents reflect a deep understanding of the challenges in the field and a dedication to improving product reliability and efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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